From an early partnership with major computer manufacturers developing ferrite memory cores to the bonding capillary work of today, GLE offers skill and experience unmatched anywhere in the world.

As a global supplier, with over 40 years’ history with major manufactures, GLE manufacturers wire bonding and semiconductor parts and components used throughout the chip industry. High finishes (mirror finishes) and flatness are of prime importance for manufacturing the finished product. Hole sizes to .003. Jewel clamps, connectors, gluing and injection nozzles, punches and tooling are a few of the parts GLE has manufactured for the chip industry.

Wire bonding involves creating interconnections between an integrated circuit or other semiconductor device and its packaging during fabrication